Effect of RE on Microstructure and Interfacial Reactions of SnAgCu Solder

Yao Li Wang; Ke Ke Zhang; Guo Ji Zhao; Li Juan Han

doi:10.4028/www.scientific.net/AMR.154-155.87

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 154-155Effect of RE on Microstructure and Interfacial...

Effect of RE on Microstructure and Interfacial Reactions of SnAgCu Solder

Abstract:

Effect of rare earth content on microstructure and interfacial reactions of low Ag content SnAgCu solder is researched by adopting the X-ray diffraction, JSM-5610LV scanning electronic microscope, energy spectrum analysis and JEM2100 ultrahigh resolution electron microscopy. The results show that proper quantities of rare earth (0.1%) can refine the eutectic microstructure of the solder alloy; and petal-like rare earth compound can be found in the solder alloy while the rare earth addition is 0.5%. The growing rate of the interfacial intermetallic compound can be reduced during the soldering with adding 0.1% rare earth in the Sn2.5Ag0.7Cu solder alloy.

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Periodical:

Advanced Materials Research (Volumes 154-155)

Pages:

87-90

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.154-155.87

Citation:

Cite this paper

Online since:

October 2010

Authors:

Yao Li Wang, Ke Ke Zhang, Guo Ji Zhao, Li Juan Han

Keywords:

Cu₆Sn₅, Interfacial Reaction, Microstructure, SnAgCuRE Solder Alloy, Surface Pattern

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