Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules

Thomas G. Lei; Jesus Calata; Shu Fang Luo; Guo Quan Lu; Xu Chen

doi:10.4028/www.scientific.net/KEM.353-358.2948

Paper Titles

A Comparative Study of the Solder Joint Reliability in Flip Chip Assemblies with Compliant and Rigid Substrates
p.2932

Behavior of Anisotropic Conductive Joints under Hygrothermal Conditions
p.2936

Interface Cracking of Plastic Electronic Package under Temperature and Humidity Environment
p.2940

Shape Prediction and Reliability Design of Ball Grid Array Solder Joints
p.2944

Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules
p.2948

Fluctuation Mechanism of Mechanical Properties of Electroplated-Copper Thin Films Used for Three Dimensional Electronic Modules
p.2954

Threshold Current Density of Electromigration Damage in Angled Polycrystalline Line
p.2958

Crack Propagation Behavior at Sn37Pb-Copper Interface in Low Cycle Fatigue
p.2962

Hardness and Elastic Modulus of ZnO Thin Films Fabricated by PLD Method
p.2966

HomeKey Engineering MaterialsKey Engineering Materials Vols. 353-358Low-Temperature Sintering of Nanoscale Silver...

Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules

Abstract:

Today, reflow soldering is a commonly used technique to establish large-area joints in power electronics modules. These joints are needed to attach large-area (>1 cm2) power semiconductor chips to the substrate, e.g., a direct-bond copper substrate, and the multichip module substrate to a copper base plate for heat spreading. Thermal performance, specifically thermal conductivity and thermomechanical reliability, of these large-area joints are critical to the electrical performance and lifetime of the power modules. Soft solder alloys, including the lead-tin eutectic and lead-free alternatives, have low thermal conductivities and are highly susceptible to fatigue failure. As demands mount for higher power density, higher junction temperature, and longer lifetime out of the power modules, reliance on solder-based joining is becoming a barrier for further advancement in power electronics systems. Recently, we successfully demonstrated lowtemperature sintering of nanoscale silver paste as a lead-free solution for achieving highperformance, high-reliability, and high-temperature interconnection of small devices (<0.09 cm2). In this paper, we report the results of our study to extend the low-temperature sintering technique to large-area joints. The study involved redesigning the organic and inorganic components of the nanoscale silver paste, analyzing the burnout kinetics of the various organic species sandwiched between large-area plates, and developing desirable temperature-time profile to improve sintering and bonding strength of the joints.

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Periodical:

Key Engineering Materials (Volumes 353-358)

Pages:

2948-2953

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.353-358.2948

Citation:

Cite this paper

Online since:

September 2007

Authors:

Thomas G. Lei, Jesus Calata, Shu Fang Luo, Guo Quan Lu, Xu Chen

Keywords:

Large-Area Joints, Lead-Free Solution, Low Temperature Sintering, Nanoscale Silver Paste, Power Electronics Modules

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