Effects of Sb and Zn Addition on Mechanical Properties and Corrosion Resistance of Sn–Ag–Cu Solders

Kittichai Fakpan; Rungsinee Canyook

doi:10.4028/www.scientific.net/KEM.728.129

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 728Effects of Sb and Zn Addition on Mechanical...

Effects of Sb and Zn Addition on Mechanical Properties and Corrosion Resistance of Sn–Ag–Cu Solders

Abstract:

Pb–free solders have been widely developed by materials researchers as mainly focused on the replacement for Sn–Pb eutectic solder. In this study, Sn–3.0Ag–0.5Cu, Sn–3.0Ag–0.5Cu–xSb and Sn–3.0Ag–0.5Cu–xZn solders (x = 1.0, 2.0 and 3.0 wt%) were prepared using melting method. The effect of Sb and Zn addition on microstructure and properties, such as tensile strength, microhardness and corrosion resistance of Sn–Ag–Cu solders was investigated. The microstructure analysis revealed that addition of Sb and Zn to the Sn–Ag–Cu solders obviously decreased phase fraction of the dendritic β–Sn phase and the finer eutectic phase was obtained, resulting in superior mechanical properties of the Sn–3.0Ag–0.5Cu–xSb and Sn–3.0Ag–0.5Cu–xZn solders compared to the Sn–3.0Ag–0.5Cu solder. The results of potentiodynamic polarization tests indicated that the corrosion potentials of the Sn–3.0Ag–0.5Cu–xSb solders continuously increased with increasing of Sb content. While Zn content had little effect on the corrosion potentials of the Sn–3.0Ag–0.5Cu–xZn solders.

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Periodical:

Key Engineering Materials (Volume 728)

Pages:

129-134

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.728.129

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Online since:

January 2017

Authors:

Kittichai Fakpan*, Rungsinee Canyook

Keywords:

Antimony, Corrosion Resistance, Mechanical Properties, Sn-Ag-Cu Solder, Zinc

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