Effect of Strain Rate on Tensile Properties of Miniature Size Specimens of Several Lead-Free Alloys

Ikuo Shohji; Yuichiro Toyama

doi:10.4028/www.scientific.net/MSF.783-786.2810

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HomeMaterials Science ForumMaterials Science Forum Vols. 783-786Effect of Strain Rate on Tensile Properties of...

Effect of Strain Rate on Tensile Properties of Miniature Size Specimens of Several Lead-Free Alloys

Abstract:

The effect of strain rate on tensile properties of several lead-free solder was investigated using miniature size specimens. High-temperature lead-free solder which are Sn-Cu and Sn-Sb alloys were prepared. Moreover, low-Ag lead-free solder which are Sn-1Ag-0.7Cu (SAC107, mass%) based alloys were prepared. Sn-3Ag-0.5Cu (SAC305) was also prepared for comparison. Tensile strength is proportion to the logarithm of strain rate in all solder investigated. Although 0.1% proof stress decreases at high strain rate in high-temperature solder, it scarcely changes in low-Ag solder. Elongation somewhat increases with increasing strain rate in high-temperature solder. It increases with increasing strain rate in low-Ag solder although it is lower than that of SAC305. Chisel point fracture mainly occurred except Sn-13Sb. In Sn-13Sb, brittle fracture occurred and thus elongation was lower than those of other solder. Sn-8.5Sb and Sn-1Ag-0.7Cu-1Bi-0.2In show mechanical properties similar to SAC305.

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Periodical:

Materials Science Forum (Volumes 783-786)

Pages:

2810-2815

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.783-786.2810

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Online since:

May 2014

Authors:

Ikuo Shohji*, Yuichiro Toyama

Keywords:

Lead-Free Alloy, Miniature Size Specimen, Strain Rate, Tensile Properties

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* - Corresponding Author

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