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Article

Analyzing the Effect of Parasitic Capacitance in a Full-Bridge Class-D Current Source Rectifier on a High Step-Up Push–Pull Multiresonant Converter

by
Anusak Bilsalam
1,*,
Chainarin Ekkaravarodome
2,
Viboon Chunkag
3 and
Phatiphat Thounthong
4
1
Department of Electrical Engineering Technology, College of Industrial Technology (CIT), King Mongkut’s University of Technology North Bangkok (KMUTNB), 1518 Pracharat 1 Rd., Wongsawang, Bang Sue, Bangkok 10800, Thailand
2
Advanced Power Electronics and Experiment Laboratory, Department of Instrumentation and Electronics Engineering, Faculty of Engineering, King Mongkut’s University of Technology North Bangkok (KMUTNB), 1518 Pracharat 1 Rd., Wongsawang, Bang Sue, Bangkok 10800, Thailand
3
Department Electrical and Computer Engineering, Faculty of Engineering, King Mongkut’s University of Technology North Bangkok (KMUTNB), 1518 Pracharat 1 Rd., Wongsawang, Bang Sue, Bangkok 10800, Thailand
4
Renewable Energy Research Centre, Department of Teacher Training in Electrical Engineering, Faculty of Technical Education, King Mongkut’s University of Technology North Bangkok (KMUTNB), 1518 Pracharat 1 Rd., Wongsawang, Bang Sue, Bangkok 10800, Thailand
*
Author to whom correspondence should be addressed.
Sustainability 2021, 13(10), 5477; https://0-doi-org.brum.beds.ac.uk/10.3390/su13105477
Submission received: 15 April 2021 / Revised: 3 May 2021 / Accepted: 6 May 2021 / Published: 13 May 2021
(This article belongs to the Special Issue Advances in Sustainable Electrical Engineering)

Abstract

:
This paper presents an analysis on the effect of a parasitic capacitance full-bridge class-D current source rectifier (FB-CDCSR) on a high step-up push–pull multiresonant converter (HSPPMRC). The proposed converter can provide high voltage for a 12 VDC battery using an isolated transformer and an FB-CDCSR. The main switches of the push–pull and diode full-bridge rectifier can be operated under a zero-current switching condition (ZCS). The advantages of this technique are that it uses a leakage inductance to achieve the ZCS for the power switch, and the leakage inductance and parasitic junction capacitance are used to design the secondary side of the resonant circuit. A prototype HSPPMRC was built and operated at 200 kHz fixed switching frequency, 340 VDC output voltage, and 250 W output power. In addition, the efficiency is equal to 96% at maximum load. Analysis of the effect of the parasitic junction capacitance on the full-bridge rectifier indicates that it has a significant impact on the operating point of the resonant tank and voltage. The proposed circuit design was verified via experimental results, which were found to be in agreement with the theoretical analysis.

1. Introduction

Currently, fossil fuel sources are being depleted owing to the considerable increase in the need for energy sources. To overcome this problem, efforts have been invested to develop renewable energy systems in the energy production field. In recent years, high step-up converters have been widely used in distributed power generators based on battery energy storage (BES) and module-integrated converters (MIC) with a DC link, and in stand-alone/grid-connected renewable energy systems such as photovoltaic cells, wind turbines, and fuel cells. These systems, which can be single or hybrid, use energy sources to generate electricity [1,2,3,4]. As these are low-voltage systems, the output voltage can be varied. For maintaining system voltage, a battery system is generally used to back-up the system with a constant DC-link in the inverter state. Therefore, to increase the low voltage of the battery to a suitable value, a high step-up converter is employed to step-up the low input voltage to a high output voltage. High step-up topologies are classified into nonisolated and isolated DC/DC converters. The nonisolated topology typically uses a boost converter structure to provide a higher output voltage from low input sources by varying the duty cycle of the pulse width modulation (PWM) [5]. At high voltage/frequency, the converter generates a high voltage spike at the power switch and high electromagnetic interference increases the switching loss and the loss due to the passive element. A significant issue with the boost converter is that when considering a low input voltage source, it is difficult to obtain a high voltage conversion ratio. To overcome this problem, the gain conversion ratio is modified to maximize the gain voltage using several techniques such as interleaved positive/negative coupling; cascading, n-stage cascading, or integrated cascading; and using multilevel cells and switch capacitors [6,7,8,9,10,11,12,13,14,15,16,17]. The overall family of high step-up converters is depicted in Figure 1. Isolated DC/DC converter topologies that include the flyback and forward converters are considered more suitable for low-voltage/-power applications because these converters only have a single switch that results in lower cost and significantly lower circuit losses during operation. High-voltage step-up techniques require high-frequency transformers.
Asymmetric pattern waveforms have disadvantages such as flux saturation and voltage/power issues on the primary side of the high-frequency transformer. However, the leakage inductance at the primary side of the transformer can place high-voltage stress on the power switch during the turn-on and turn-off states [18,19,20,21,22,23]. A Class-E inverter is a topology with the advantages of using a single switch, a simple gate driving circuit, and all its parameters can be calculated. However, the high voltage across the power switch has a limitation as it is approximately three ranges higher than that of the input voltage [24,25,26]. Therefore, two switch converters among half-bridge, push–pull, and Class-D converters are preferred when applying high power. The half-bridge and full-bridge topologies can easily achieve zero-voltage switching (ZVS). The reverse–recovery of the main power switches in the body diodes is an important problem as it causes a significant drop in overall efficiency owing to the electromagnetic interference from the high output voltage. The source can be categorized as either a voltage-fed source or a current-fed source. The current-fed source consists of an inductor input connected in series with a power switch to reduce the current ripple and to limit the current input. This structure, with an active switch clamp, is used to reduce the voltage spike on the power switch generated by the inductor input side [27,28,29,30]. The push–pull converter is more effective for low to medium power operations owing to its two switches, low component count, and simple gate driving circuit [18,19,20,21,22,23,24,25,26,27,28,29,30,31,32,33,34,35,36,37,38]. For this converter, both the current-fed and voltage-fed topologies can be employed in either the PWM or the resonant modes to achieve the ZVS, ZCS, or ZVCS conditions [31,32,33,34,35,36,37,38]. For low-voltage high-current input applications, ZVS is not particularly important, whereas zero-current switching (ZCS) is critical to eliminate switching losses. In the resonant mode, a resonant tank is connected to a half-wave/full-wave bridge or a center-tap and to voltage double rectifiers [39,40,41]. However, a diode with a common rectifier in a low-frequency range with parallel parasitic capacitance can affect the main state when we consider both the main factors in a high step-up application depending on voltage and switching frequency range. The resonant techniques enable a high step-up and frequency converter while operating simultaneously with high switching frequency, and the rectifier can be utilized to achieve parasitic capacitance in parallel and series–parallel resonant tanks. In terms of the rectifier circuit, the parasitic capacitance of the rectifier can be used for the resonant tank. In the literature, the parasitic capacitance can be used in parallel, and the series–parallel resonant tanks are mentioned to increase the load quality factor. However, a high output voltage under light-load conditions can occur, and this can possibly damage the diode rectifier [42,43,44,45,46,47].
The remainder of this paper is organized as follows. The proposed circuit is described in Section 2; Section 3 presents the circuit analysis; the analysis modeling resonant and parasitic capacitance rectifier is shown in Section 4; the design procedure for the component is shown in Section 5; experimental results are presented in Section 6; a discussion of the effected parasitic capacitance parameter and the experimental results are presented in Section 7; and, finally, the conclusion is provided in Section 8.

2. Circuit Description

The main circuit consists of power switches, a high-frequency center-tap transformer, a resonant tank, a full-bridge rectifier, an output capacitor, and a resistance load. The HSPPMRC consists of two switches, M1, M2, with a duty ratio of nearly 0.5; an antiparallel body diode; and a parasitic capacitance drain–source CM1, CM2 of MOSFETs. The equivalent circuit model of the transformer consists of leakage inductances at the primary side Lp1, Lp2 and a resonant inductance Llks at the secondary side. The secondary-side leakage inductance of the high-frequency transformer is connected in series with capacitor Cr and in parallel with parasitic capacitance full-wave bridge rectifier Ce. The parameter values of the leakage inductance at the high-frequency transformer depend on the physical structure such as the magnetic material, air gap, and the coil-winding technique used. The equivalent circuit model of the center-tap transformer of the push–pull converter is shown in Figure 2. The parameter values of the transformer can be measured using the LCR meter. However, the magnetizing inductance of the transformer values is higher than the leakage inductance Llks for both sides and, therefore, it can be ignored. The resonant capacitor Cr is a series capacitor that includes the leakage inductance and parallel parasitic junction capacitor Ce when the junction capacitor of each diode is CD = CD1 = CD2 = CD3 = CD4 of the FB-CDCSR. In the resonant circuit, each diode is operated under the ZCS condition. The output capacitance is very large; therefore, the output voltage Vo is constant and supplies a load Ro. The resonant circuit feeds a square-wave voltage and a sine-wave current to the secondary side. This high frequency is used to drive the FB-CDCSR.

3. Circuit Analysis

The principles of the power state of HSPPMRC are explained as shown in Figure 2. The main power switch and the diode rectifier operate under the ZCS condition. It is appropriate to consider the secondary side of the transformer as a sinusoidal current source ir, which is also a high-frequency current source of the full-bridge rectifier. Figure 3 shows that the key waveforms consist of a gate driven by switches vgs1, vgs2; voltage across vds1, vds2; current of switch iM1, iM2; voltage resonant vrec; current of resonant ir; overall voltage across vD1-vD2-vD3-vD4; and a current of the diode rectifier iD1-iD2-iD3-iD4. The proposed circuit can be operated under four modes, as shown in Figure 4. The analysis of the circuit begins with these following assumptions.
  • The main power switch and active/passive elements in the on and off state are equal to zero and have infinite resistance.
  • All passive components in the circuit are ideal and the initial condition is equal to zero.
  • The load quality factor is higher so that the current is sinusoidal.
  • The transformer is ideal and the value inductance of the primary side 1 is similar to the value of primary side 2.
  • The output capacitor is sufficiently large for the output voltage to be constant.
Mode 1: This mode is depicted in Figure 4a. First, the power switch M1 is turned on while switch M2 is off. The current flows from the DC input source Vin to the drain–source of MOSFET M1 when switch M1 is turned on and operated under the ZCS condition by the commutation of the leaked inductance, magnetizing current transformer, and the drain–source junction capacitance. Simultaneously, the junction capacitor CM1 of M1 discharges the voltage and decreases to zero, and the junction capacitor voltage vds2 of M2 charges the voltage from zero to twice the voltage of the DC input source. Then, the energy is transferred to the secondary side, diodes D1 and D4 are turned on, and diodes D2 and D3 are turned off under the ZCS condition by the flow of current iD1 and iD4 through the diode rectifier and resonant circuit.
Mode 2: As depicted in Figure 4b, the commutation between M1 and M2 is turned off. The junction capacitor drain–source CM1 of M1 charges the voltage vds1 until it increases to twice that of the DC input source, and the junction capacitor drain–source CM2 of M2 discharges voltage vds2 until the voltage decreases from twice that of the DC input source to zero. At the same time, the junction capacitors CD1 and CD4 of diodes D1 and D4 discharge to the zero value, and the junction capacitor CD2 and CD3 of diodes D2 and D3 charge from zero to the negative output voltage, as shown in Figure 4b.
Mode 3: This mode is similar to Mode 1. As shown in Figure 4c, the gate driving circuit turns M2 on and turns M1 off. The current flows from the DC input Vin to the drain–source of MOSFET M2 when M2 is turned on and operated under the ZCS condition by the commutation of the leaked inductance, magnetizing current transformer, and drain–source junction capacitance. Simultaneously, the voltage of the junction capacitor CM2 in M2 discharges to zero. At the same time, the junction capacitor voltage vds1 of M1 charges the voltage from zero to twice the voltage of the DC input source. Then, the energy is transferred to the secondary side, the diodes D2 and D3 are turned on, and diodes D1 and D4 are turned off under the ZCS condition under the flow of current iD2 and iD3 through the diode rectifier and resonant circuit.
Mode 4: This is depicted in Figure 4d. The junction capacitor drain–source CM2 of M2 charges voltage vds2 until the voltage increases to twice that of the input source and the junction capacitor drain–source CM1 of M1; then, it discharges the voltage vds1 until the voltage decreases from twice that of the input source to zero. Simultaneously, the junction capacitors CD2 and CD3 of diodes D2 and D3 discharge to a zero value. Then, diodes D2 and D3 are turned off by ZCS and the junction capacitors CD1 and CD4 of the diodes D1 and D4 charge from zero to the negative output voltage. In fact, there are four assumptions based on the analytical operation in FB-CDCSR, the input current source ir sin ωst has a sinusoidal waveform and is the same between the switching and resonant frequency, and each parasitic junction capacitance CD1-CD2-CD3-CD4 of the full-wave rectifier has the same value.
All the parasitic junction capacitances Ce have an “equivalent parasitic capacitance”, which operates as an equilibrium in the commutation range and at a constant value. The final assumption is used to simplify the analysis, and the parasitic junction capacitance with respect to the reverse bias voltage is not considered. From Figure 3, both the junction capacitors CD2 and CD3 of diodes D2 and D3 discharge to a zero value at the same time t0-t1. The top diode D1 and cruciate diode D4 turn on. At time t1-t2, when ir is still charging CD2-CD3 and discharging CD1-CD4, the conducting mode ends, CD2-CD3 is fully charged, and CD1-CD4 discharges to zero. In this section, we define commutation period τ = t1-t0 and t3-t2 and the commutation angle, where fs and ωs are the switching and angular frequency, respectively. From the first harmonic approximation technique used to find the real and reactive voltage fundamental component of the FB-CDCSR, the real part value can be expressed as
v A B - r e a l = 1 π 0 2 π v A B sin ( ω s t ) d ( ω s t )
We obtain the condition as shown:
v A B r e a l { I r p ω s C D ( 1 cos ( ω s t ) ) V o sin ( ω s t ) d ( ω s t ) , t 0 t 1 V o sin ( ω s t ) d ( ω s t ) , t 1 t 2 V o sin ( ω s t ) d ( ω s t ) I r p ω C D ( 1 cos ( ω s t ) ) , t 2 t 3 V o sin ( ω s t ) d ( ω s t ) , t 3 t 4
Voltage across the rectifier in a real term is shown below:
v A B r e a l = I r p π ω s C D ( 1 2 cos ( ω s τ ) + cos 2 ( ω s τ ) 2 + 1 + cos ( 2 ω s π + 2 ω s τ ) 4 ) + 4 V o cos ( ω s τ )
v A B r e a l = 1 π ( I r p ω s f s C D ( 1 cos 2 ( ω s τ ) ) )
Similarly, the reactive part fundamental component value can be expressed as
v A B - r e a c t = 1 π 0 2 π v A B cos ( ω s t ) d ( ω s t )
Afterwards, the condition under analysis for voltage across the rectifier in an imaginary term can be found.
v A B r e a c t { I r p ω s C D ( 1 cos ( ω s t ) ) V o cos ( ω s t ) d ( ω s t ) , t 0 t 1 V o cos ( ω s t ) d ( ω s t ) , t 1 t 2 V o I r p ω s C D ( 1 cos ( ω s t ) ) cos ( ω s t ) d ( ω s t ) , t 2 t 3 V o cos ( ω s t ) d ( ω s t ) , t 3 t 4
Voltage across the rectifier in an imaginary term is shown below:
v A B r e a c t = 1 π ( I r p ω s C D ( 2 sin ( ω s τ ) 2 ω s τ 2 ) ) ( sin ( 2 ω s τ + 2 ω s π ) sin ( 2 ω s π ) ) 4 + 4 V o sin ( ω s τ )
v A B r e a c t = 1 π ( I r p ω s C D ( 2 ω s τ 2 sin ( 2 ω s τ ) 2 + sin ( 2 ω s τ ) ) )
Furthermore, the find section of output voltage Vo can have two conditions. In t0t1, the parasitic junction capacitance changes during the commutation time as
V o , t 0 t 1 = 1 C D 0 τ I r p 2 sin ( ω s t ) d ( ω s t )
V o , t 0 t 1 = I r p 4 π f s C D ( 1 cos ( ω s t ) )
From t1t2, during the commutation time, vD2 and vD3 are equal to output voltage. vD1 and vD4 are zero and both diodes conduct the following input current resonant ir, which can be found using (11) and (12):
V o , t 1 t 2 = ω s R o π 0 T / 2 I r p sin ( ω s t ) d ( ω s t )
V o , t 1 t 2 = R o I r p π ( cos ( ω s τ ) + 1 )
(10) and (12) show the charge/discharge of the parasitic junction capacitance and during commutation. It can be rewritten as the characteristic commutation angular time, showing that
I r p 4 π f s C D ( 1 cos ( ω s τ ) ) = R o I r p π ( cos ( ω s τ ) + 1 )
cos ( ω s τ ) = ( 1 4 R o f s C D 1 + 4 R o f s C D )
In (4), (8), and (14), when considering an ideal case, the parasitic junction capacitance CD equals to zero, in which the input voltage and current resonant in phase are a simplified real and reactive part of the fundamental component as divided into
V a b , C D 0 = 8 R o I r p π 2
v a b - r e a l , C D 0 = I r p 2 π 2 f s C D sin 2 ( ω s τ ) = V a b , C D 0 ( 1 + 4 f s R o C D ) 2
v a b - r e a c t , C D 0 = I r p 4 π 2 f s C D ( sin ( 2 ω s τ ) 2 ω s τ ) = V a b , C D 0 32 f s R o C D ( sin ( 2 ω s τ ) 2 ω s τ )

4. Analysis Modeling Resonant and Parasitic Capacitance Rectifier

In this section, we analyze the parasitic capacitance of FB-CDCSR in a resonant tank circuit. In the first step, the model combines the HSPPMR and FB-CDCSR circuits. The MOSFETs are modeled by both switches with turned-on resistances. Resistances and inductances are parasitic equivalent circuits of the transformer. The main switch M1 operates in the positive half-cycle, whereas the main switch M2 operates in the negative half-cycle. From Figure 5a, the high-frequency square-wave voltage source vin is transferred from two windings on the primary side to the secondary side. The leakage inductance Lr is connected in series to the resonant capacitor Cr and is calculated from the transferred inductances Llk11 and Llk12 in the primary side, as per (Llk11 + Llk12)(n/2)2 + Llks. The parasitic junction capacitance in the FB-CDCSR for the HSPPMRC, where diodes D1 and D4 of the rectifier operate during the positive cycle of a high-frequency square-wave voltage source, is a fundamental component amplitude that equals to vin sin ωst, where vin is the voltage across the secondary side. This amplitude is similar to that of diodes D2 and D3 of the rectifier, which operate during the negative cycle. The equivalent circuit affects the parasitic junction capacitance of the FB-CDCSR diode under a high voltage and high switching frequency operation. Owing to the short circuit of the AC voltage source on the secondary side, the junction capacitor CDA/2 is derived from diodes D1 and D3, whereas the junction capacitor CDB/2 is obtained from diodes D2 and D4, as demonstrated in Figure 5b. In this circuit, capacitor CD is a parallel combination of the junction capacitor CDA of diodes D1 and D3 and the junction capacitor CDB of diodes D2 and D4, which can be considered as one capacitor CDAB = CDA/2 + CDB/2. The CDAB parameter is parallel with the AC resistance Rac transformed from the DC resistance of the output side. The final model between the parasitic junction capacitor of the push–pull resonant converter is illustrated in Figure 5c. The output voltage equals the voltage of the AC resistor parallel with the parasitic junction capacitors, and the input voltage equals the voltage on the secondary side.
Z i   =   s L r + ( 1 s C r ) + ( R a c s C e R a c + 1 ) Z o   =   R a c s C e ( R a c + 1 s C e ) }
From (18), we can rewrite the transfer function as
v A B v i n ( s ) = ( 1 s L r + 1 s C r + R a c s C e R a c + 1 ) × ( R a c s C e R a c + 1 )
Hence, the normalized voltage gain of the resonant circuit can be described as
t f ( s ) = s C r R a c s 3 L r C r C e R a c + s 2 L r C r + s ( C e R a c + C r R a c ) + 1
Further, the input impedance Zi of the resonant circuit with the variable parasitic junction capacitors can be written as
Z i ( s ) = s 3 L r C r C e R a c + s 2 L r C r + s ( C e R a c + C r R a c ) + 1 s 2 C r C e R a c + s C r
where Rac and Cr are the normalized resistance and capacitance resonance, respectively.
The value of the AC resistance Rac and the combination of the parasitic junction capacitors Ce that can be plotted to adjust the switching frequency are shown in Figure 6, Figure 7, Figure 8 and Figure 9.
R a c = 8 R o π 2
τ = 1 ω s cos 1 ( 1 4 f s R o C D 1 + 4 f s R o C D )
In terms of the commutation stages of the parasitic junction capacitors on the rectifier circuit, the fundamental current is sinusoidal and the voltage is a square wave in the analysis of diode commutation time τ during the final time period when the junction capacitors are charged to the output voltage and discharged to zero. Therefore, the equivalent capacitance of the full-bridge rectifier Ce is related to the parallel resistance and the connected series resonant Lr and Ce, which can be found using (5), (11), and (15) as
C e = ( π 16 R o f s ) ( sin 2 ω s τ 2 ω s τ / 32 f s R o C D ( sin 2 ω s τ / 16 f s R o C D ) 2 + ( sin 2 ω s τ 2 ω s τ / 32 f s R o C D ) 2 )
The plots of the normalized voltage gain of the resonant circuit versus the operating frequency at different values of the AC resistance are shown in Figure 6a. The range of the AC resistance varies from Rac/8 to 8Rac of the load Rac. In our design, the switching frequency can be operated from the nearly resonant operating point until the full load for all values of output resistance. When the capacitance varies from Cr/8 to 8Cr of load Cr, the operating point of the circuit increases from half to threefold in Figure 6b. This frequency increases proportionally with the regulated output voltage. Figure 7a shows the input impedance of the resonant circuit versus the frequency while the parasitic junction capacitance is varied. It can be seen that under the high frequency range, the input impedance changes dramatically with the increasing parasitic junction capacitance, and this leads to output voltage variation. When the resistance load is constant, the operating resonance frequency point increases more than the switching frequency. The changes, with an increase in the parasitic junction capacitance, vary from Ce/8 to Ce/2 and can be noticed in the series resonant tank, where varying Ce results in the operating point switching and voltage gain moving on less than unity, and the operating point of the resonance moves from low to high frequencies. Then, the next simulation step changes from the Ce to 8Ce operating point from series to series–parallel resonant models. The parasitic junction capacitance affects the voltage transfer function gain and the type of resonant tank topologies, as shown in Figure 7b.

5. Design Procedure

The analysis and design of the HSPPSC for FB-CDCSR was divided into two parts. The first part involves the design of the power state and the parasitic junction capacitance in the FB-CDCSR, whereas the second part involves the analysis of the overall power loss. The design procedure for the power state and the analysis of the effect of the junction capacitance, as described in Figure 2, Figure 5, and Figure 9, are provided below.
  • Choose the voltage output Vo and the output power Po to determine the DC side-load resistance; it is then transferred to the resistance of the AC Rac side.
  • Find the load quality factor QL value at full load, when the switching frequency fs is approximately equal to the resonant frequency.
  • Find the junction capacitance Ce in the FBCSR from the characteristic diode.
  • Find the equivalent resonant capacitance Cr.
  • Find the value of the output capacitor Co and choose the ripple output to be less than 2%.
  • Finally, calculate the conduction loss in the power switch Prds; the power loss in the diode rectifier PDB; the loss in transformer Prp, Prs; and the gate driving circuit loss Pgs.

5.1. High Step-up Push–Pull Multiresonant Converter

The proposed HSPPSC circuit is shown in Figure 2. In the steady-state operation, the circuit was designed to be operated at a 200 kHz fixed switching frequency, 12 VDC input voltage, and a maximum power output of 250 W at an output voltage of 340 VDC. Therefore, at the full load condition, the output resistance Ro is given by
R o = V o 2 P o = ( 340 ) 2 250 = 462.4   Ω
The AC resistance calculated from (13) is Rac = 8Ro/π2 = 374.80 Ω, which is the transferred resistance from the DC output side to the AC input side of the rectifier. When considering the voltage waveform as a high-frequency square wave and the current input of a full-bridge rectifier as a sinusoidal waveform, the maximum output power is 250 W; further, it is assumed that the total efficiency η is equal to 0.95. The peak input current Iin-peak is given by
I i n p e a k = π P o 2 η V i n = π × 250 2 × 0.95 × 12 = 34.44   A
The equivalent capacitance Ce and diode commutation time τ are expressed in (23) and (24). The calculated commutation time is τ = 0.263. µs when ωs is an angular switching frequency, fs is a switching frequency, and CD is the combined parasitic capacitance of FB-CDCSR. The equivalent circuit in Figure 5c includes the parasitic capacitance diodes. The circuit method suggests an absolute capacitance Ce = 0.4 nF. Next, the design parameters of the leakage inductance from the primary side to the secondary side were determined, as listed in Table 1. The resonant inductance Lr is 389.80 µH. Then, assuming that the switching frequency is the same as the resonant frequency fs = fr at full load, the loaded quality factor QL is given as
Q L = 2 π f r L r R a c = 2 π × 200 × 10 3 × 389.80 × 10 6 345.80 = 1.416
From (19), the resonant capacitor is obtained as
C r = 1 2 π f r Q L R s = 1 2 π × 200 × 10 3 × 1.416 × 248.23 = 2.2   nF
The calculation of the resonant capacitance Cr is derived from (28) and composed between the resonant capacitance and equivalent capacitance of the FB-CDCSR. Therefore, equivalent resonant capacitance Ceq = CrCe = 1.8 nF. Finally, the value of the output capacitor Co, which is used for energy storage and regulation of the output voltage to obtain a ripple voltage Vrip less than 2%, is given as
C o V o 2 f s R o V r i p = 340 2 × 200 × 10 3 × 612.5 × 6.8 = 0.270   μ F
From the calculation, Co = 0.270 µF. Then, the standard capacitor value of 0.33 µF/600 V was chosen for Co.

5.2. Analysis Conduction Power Loss and Efficiency

The main power loss in the proposed circuit can occur in three major parts: power MOSFET push–pull converter, high-frequency push–pull transformer, and power diode full-bridge rectifier. The MOSFETs were modeled using switches with turn-on resistances rds1 and rds2. Resistances rp1, rp2, and rs represent the parasitic equivalent resistance of the physical structure of the primary and secondary leakage inductors Llkp1, Llkp2, and Llks of the high-frequency transformer, respectively. The power diodes were modeled using switches for a constant voltage source; forward voltage drop VFD; and on-resistance of four diodes rD1-, rD2-, rD3-, rD4. The push–pull converter main switches employ IRFP 3205 (International Rectifier), and each switch has an on-resistance rds = 8 mΩ. Therefore, the power loss in each switch of the MOSFETs turn-on resistance rds can be obtained by (30).
P r d s = I i n p e a k 2 r d s 4 = 34.44 2 × 8 × 10 3 4 = 2.37   W
Then, the full-wave bridge rectifier used the MUR 860 (Intersil) as a fast recovery diode with a forward voltage drop of 1.5 V. The power loss in the diode rectifiers D1-, D2-, D3-, D4 due to the forward voltage drop VFD for two diodes, 2VFD, is given as
P D = 2 V F D P o V o = 2 × 1.5 × 250 340 = 2.20   W
The electrical series resistance of the primary side of the leakage inductor rp = rp1 = rp2 is equal to 12 mΩ, and the parasitic resistance of the secondary side of the leakage inductor rs = 3.26 Ω, which was measured by an LCR meter. Therefore, the conduction loss in the resonant inductor primary side Lp = Lp1 = Lp2 and secondary side Ls can be determined by (32) and (33), respectively.
P r p = I i n p e a k 2 r p 4 = 34.44 2 × 12 × 10 3 4 = 3.55   W
P r s = I r p e a k 2 r s 2 = 1.424 2 × 3.26 2 = 3.30   W
The maximum value of the resonant current I r p e a k can be obtained as
I r p e a k = π V o R a c ( cos ω τ + 1 ) = π × 340 374.80 ( cos ( 2 π × 200 × 10 3 × 0.263 × 10 6 ) + 1 ) = 1.424   A
The gate-driven power loss of each MOSFET is that of the push–pull multiresonant converter at high frequency. This loss can be calculated by
P G = 2 f s V g s p e a k Q g = 2 × 110 × 10 3 × 15 × 146 × 10 9 = 0.48   W
where Vgs-peak is the peak voltage gate-driven between the gate–source terminal of the MOSFETs and Qg is the value gate charge of a power switch. Hence, the total efficiency of FBCSR and HSPPMRC can be obtained as
η = P o P o + ( P r d s + P D + P r p + P r s + P G ) = 250 250 + ( 2.37 + 2.20 + 3.55 + 3.30 + 0.48 ) = 0.954

6. Experimental Results

A prototype of the HSPPSC for the FB-CDCSR was simulated and built. The circuit parameters presented in Table 1 were used in the experiment. The switching frequency was fixed at approximately 200 kHz. The overall experimental results are shown in Figure 9, Figure 10 and Figure 11. The voltage, current, and power at the input side were measured and the input power was approximately 260 W, as shown in Figure 9a. Figure 9b,c shows the switch voltages and current, and it can be seen that both power MOSFET switches operate under the ZCS condition. The input voltage waveform of the FB-CDCSR is a high-frequency square-wave voltage vrec and the current resonant ir is a sinusoidal waveform, as shown in Figure 9d. The waveform and zoom-in of a diode voltage vD1, current iD1, and all the diodes are operated under the ZCS condition are shown in Figure 10a,b. The measured waveform’s voltage, current, and power at the output side has a maximum value equal to 250 W, as shown in Figure 10c. Figure 10d shows the experimental results of the proposed circuit under a no-load condition. In the output voltage waveform, the measured value is approximately 580 VDC. Figure 12a shows the regulation of the output voltage when the switching frequency is varied from 150 to 250 kHz. The minimum and maximum output voltages at full load are approximately 340 VDC at a switching frequency of 200 kHz, and both output voltages are equal to 320 and 360 VDC at switching frequencies of 150 and 250 kHz, respectively. It can be seen that the output voltage change narrows the switching frequency range. The measured efficiency of the HSPPSC for the FB-CDCSR was approximately 95% at the full-load condition, and the maximum efficiency was 96% at approximately 250 W. The overall relationship values of the efficiency, output voltage, and output power are shown in Figure 12b.

7. Discussion of the Effected Parasitic Capacitance Diode of the FB-CDCSR and Experimental Results

In this section discussion of the effected parasitic capacitance and comparison of previously proposed are shown Table 2 and Table 3. The parasitic capacitance parameter values can be seen in the relationship curves shown in Figure 6 and Figure 7. The results showed some changes in the output voltage with increasing switching frequency and load ranges. When the latent capacitor value generated from the rectifier circuit is used, it changes to a latent parasitic capacitor. When determining the higher switching frequency used in the circuit, the capacitance increased in value, which resulted in the original calculation being inaccurate. This is because parasitic capacitance affects the layout, placement, and response-rate ratio of the output voltage to the input voltage, including the operating point of the resonant frequency that occurs in the circuit. In Figure 8 and Figure 12c, equivalent circuit for the conduction loss analysis and overall loss breakdown of the proposed circuit is given as follows. The most significant losses are those that occur in the primary and secondary windings of the high-frequency eques of 3.55 and 3.30 W. The losses, which amount to 1.36 and 1.26% in this section, can be calculated to be 2.62%. The loss in the following section of the MOSFET push–pull converter and power diode rectifier eques were 2.37 and 2.20 W, with losses from each component of 0.91 and 0.84%, respectively. Finally, loss occurred at the gate-driven power switch owing to its operation in the high-frequency range. The power loss in this section is of importance and was equal to 0.48 W and 0.18%.
In addition, in Figure 11a,b, the measured zoom voltage vds2 and current waveform iM2 of MOSFET M2 under the turn-off and turn-on conditions show the voltage and current that pass through each other, which resulted in the loss of this part being greatly reduced. This confirms the route voltage and current in the relationship of the routes of switch voltage vds2 and current waveform iM2 of MOSFET M2. The route power loss of voltage vD1 and current iD1 of the diode in the path of loss of both switches are shown Figure 11c,d. The power loss is also low because the main power switch and diode rectifier are operated under the ZCS condition. In the section operated in full resonant mode, from the power state, it can achieve a reduced maximum peak current of the diode rectifier.

8. Conclusions

This paper presented the parasitic capacitance of an FB-CDCSR design in the HSPPMRC. Both power switches of the push–pull resonant circuit received 12 VDC input voltage from a battery and converted it to a high output voltage of 340 VDC at an output power of 250 W, when operating at a 200 kHz fixed frequency. The efficiency of the system was measured and a value of 96% was obtained at full power. The advantages of using this method are as follows:
  • High voltage gain conversion ratio;
  • Less components in the system;
  • Leakage inductance and parasitic junction capacitance of the diode rectifier in the designed resonant tank, and simplified calculation;
  • Additionally, the magnetic flux current in both main power switches can be easily balanced by a small leakage inductance at the input side.
Therefore, the generation and application of the conversion circuit is necessary to convert low-voltage DC to high voltage, and the effect of the latent charge that occurs in the rectifier circuit should be considered. Parasitic capacitance is important and, therefore, should be considered in the design. Moreover, it was demonstrated that the parasitic junction capacitance of the diode rectifier had a significant impact on the operation point of the resonant tank circuit in the high-frequency range. Furthermore, it had a direct impact on the output voltage of the high-voltage-gain isolated front-end converter.

Author Contributions

Formulation and evolution of overarching research goals and aims, development and design prototype circuit, verification of results/experiments and other research outputs, prepare manuscript (original draft), A.B.; application of mathematical and simulation computational, recheck formal techniques to analyze study data and experimental result, C.E.; Management and coordination responsibility for the research activity planning and execution, preparation, of the published work, specifically writing the initial draft (including substantive translation), V.C.; Mentor advisor, acquisition of the financial support for the project leading to this publication, oversight and leadership responsibility for the research activity planning and core team, P.T. All authors have read and agreed to the published version of the manuscript.

Funding

This research was funded by King Mongkut’s University of Technology North Bangkok (KMUTNB), Thailand, for financially supporting this research under Contract No. KMUTNB-60-GOV-010.

Institutional Review Board Statement

Not applicable.

Informed Consent Statement

Not applicable.

Data Availability Statement

Not applicable.

Conflicts of Interest

The authors declare no conflict of interest.

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Figure 1. Family of high step-up converters and the proposed high step-up push–pull resonant converter.
Figure 1. Family of high step-up converters and the proposed high step-up push–pull resonant converter.
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Figure 2. Proposed parasitic capacitance full-wave bridge class-D current source rectifier design in the high step-up push–pull multiresonant converter.
Figure 2. Proposed parasitic capacitance full-wave bridge class-D current source rectifier design in the high step-up push–pull multiresonant converter.
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Figure 3. Key waveforms of the proposed circuit.
Figure 3. Key waveforms of the proposed circuit.
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Figure 4. Operation modes of the proposed circuit. (a) Power switch M1 is turned on while power switch M2 is turned off; (b) commutation time of M1 while M2 is turned off; (c) power switch M2 is turned on while power switch M1 is turned off; (d) commutation time of M2 while M1 is turned off.
Figure 4. Operation modes of the proposed circuit. (a) Power switch M1 is turned on while power switch M2 is turned off; (b) commutation time of M1 while M2 is turned off; (c) power switch M2 is turned on while power switch M1 is turned off; (d) commutation time of M2 while M1 is turned off.
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Figure 5. Equivalent circuit for the parasitic capacitance of FB-CDCSR. (a) Equivalent circuit of the FB-CDCSR including parasitic capacitance; (b) equivalent square-wave voltage source circuit is connected, affecting parasitic capacitance; (c) semi- and final equivalent resonant circuit including parasitic capacitance of the FB-CDCSR.
Figure 5. Equivalent circuit for the parasitic capacitance of FB-CDCSR. (a) Equivalent circuit of the FB-CDCSR including parasitic capacitance; (b) equivalent square-wave voltage source circuit is connected, affecting parasitic capacitance; (c) semi- and final equivalent resonant circuit including parasitic capacitance of the FB-CDCSR.
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Figure 6. Relationships of the matching resonant tank of the proposed circuit. (a) Normalized voltage gain of resonant circuit versus frequency at varied AC resistance; (b) normalized voltage gain of resonant circuit versus frequency at varied AC capacitor resonant load; and (c) input impedance of the resonant circuit versus the frequency at a variable parasitic junction capacitance.
Figure 6. Relationships of the matching resonant tank of the proposed circuit. (a) Normalized voltage gain of resonant circuit versus frequency at varied AC resistance; (b) normalized voltage gain of resonant circuit versus frequency at varied AC capacitor resonant load; and (c) input impedance of the resonant circuit versus the frequency at a variable parasitic junction capacitance.
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Figure 7. Relationships affecting parasitic junction capacitance on the matching resonant tank of proposed circuit. (a) Input impedance of the resonant circuit versus the frequency at a variable parasitic junction capacitance and (b) normalized voltage gain of resonant circuit versus frequency at a varying capacitor resonant Ce load.
Figure 7. Relationships affecting parasitic junction capacitance on the matching resonant tank of proposed circuit. (a) Input impedance of the resonant circuit versus the frequency at a variable parasitic junction capacitance and (b) normalized voltage gain of resonant circuit versus frequency at a varying capacitor resonant Ce load.
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Figure 8. Equivalent circuit for the conduction loss analysis.
Figure 8. Equivalent circuit for the conduction loss analysis.
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Figure 9. Experimental results. (a) Measured voltage Vin, current Iin, and power Pin waveform on the input side; (b) measured switch voltage vds1 and current waveform iM1 of MOSFET M1; (c) measured switch voltage vds2 and current waveform iM2 of MOSFET M2; and (d) measured input voltage rectifier vrec and resonant current ir waveforms.
Figure 9. Experimental results. (a) Measured voltage Vin, current Iin, and power Pin waveform on the input side; (b) measured switch voltage vds1 and current waveform iM1 of MOSFET M1; (c) measured switch voltage vds2 and current waveform iM2 of MOSFET M2; and (d) measured input voltage rectifier vrec and resonant current ir waveforms.
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Figure 10. Experimental results of FB-CDCSR. (a) Measured voltage vD1 and current iD1 of the diode; (b) measured zoomed-in top view of voltage vD1 and current iD1 of the diode; (c) measured voltage Vo, current Io, and power Po waveforms on the output side; and (d) measured output voltage Vo under a no-load condition.
Figure 10. Experimental results of FB-CDCSR. (a) Measured voltage vD1 and current iD1 of the diode; (b) measured zoomed-in top view of voltage vD1 and current iD1 of the diode; (c) measured voltage Vo, current Io, and power Po waveforms on the output side; and (d) measured output voltage Vo under a no-load condition.
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Figure 11. Experimental results of power loss. (a) Measured zoom-in voltage vds2 and current waveform iM2 of MOSFET M2 under the turn-off condition; (b) measured zoom-in voltage vds2 and current waveform iM2 of MOSFET M2′s turn-on condition; (c) relationship power loss of route switch voltage vds2 and current waveform iM2 of MOSFET M2; and (d) relationship power loss of route voltage vD1 and current iD1 of the diode.
Figure 11. Experimental results of power loss. (a) Measured zoom-in voltage vds2 and current waveform iM2 of MOSFET M2 under the turn-off condition; (b) measured zoom-in voltage vds2 and current waveform iM2 of MOSFET M2′s turn-on condition; (c) relationship power loss of route switch voltage vds2 and current waveform iM2 of MOSFET M2; and (d) relationship power loss of route voltage vD1 and current iD1 of the diode.
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Figure 12. Experimental results of the relationship with a breakdown and photograph. (a) Relationship between output voltage Vo and varying frequencies fs; (b) relationship between the efficiency and output power Po and output voltage Vo; (c) breakdown of the overall conduction power loss of the proposed circuit; and (d) prototype photograph of the proposed HSPPMRC, including the effected parasitic capacitance parameter.
Figure 12. Experimental results of the relationship with a breakdown and photograph. (a) Relationship between output voltage Vo and varying frequencies fs; (b) relationship between the efficiency and output power Po and output voltage Vo; (c) breakdown of the overall conduction power loss of the proposed circuit; and (d) prototype photograph of the proposed HSPPMRC, including the effected parasitic capacitance parameter.
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Table 1. Circuit parameters of the prototype.
Table 1. Circuit parameters of the prototype.
ParameterSymbolValue/Part NumberType
Input voltageVin12 VDC-
Output voltageVo340 VDC-
Output powerPo250 W-
Output capacitorCo0.33 µFPolypropylene
Switching frequencyfs200 kHzSG3525 Gate Driver
Power MOSFETsM1, M2IRFP 3205N-Chanel MOSFETs
Fast recovery diodeD1D4MUR 860Fast-Recovery Diode
Resonant capacitanceCr1.8 nFPolypropylene
Resonant inductanceLr389.8 µHEE42/13/7 N87-EPCOS
Inductance primaryLp1, Lp212.07 µH, 12.02 µHEE42/13/7 N87-EPCOS
Inductance secondaryLs14.50 mHEE42/13/7 N87-EPCOS
Leakage inductance primaryLlk1, Llk20.41 µH, 0.43 µHEE42/13/7 N87-EPCOS
Parasitic junction capacitor diodeCD1-CD475 pF-
Table 2. Comparison of previously proposed high step-up converters and their relevant publications.
Table 2. Comparison of previously proposed high step-up converters and their relevant publications.
ParameterRef [4]Ref [8]Ref [17]Ref [19]Ref [20]Proposed
Circuit
Range input voltage48 VDC60 VDC24 VDC24 VDC35 VDC12 VDC
Range output voltage400 VDC380 VDC400 VDC200 VDC400 VDC340 VDC
Switching frequency120 kHz120 kHz40 kHz100 kHz100 kHz200 kHz
Range output power400 W1 kW400 W60 W300 W250 W
Range efficiency≥90%≥90%≥90%≥90%≥90%≥90%
Conversion ratio8.336.3316.668.3311.4228.3
Topology circuitseries 2 boost convertersbuck–boost clamp modeboost voltage
multiplier cells
Modify-flyback
volt double
Flyback-active clamp voltage
multiplier
push–pull
traditional
Voltage across switchesnormalnormalnormalhigh normalnormal
Number of switches1 main
1 auxiliary
1 main1 main1 main1 main
1 active clamp
2 mains
Number of capacitors513241
Number of inductors1 transformer
(2 inductors)
nonisolated
1 transformer
(2 inductors)
nonisolated
2 inductors
nonisolated
1 transformer
(2 inductors)
nonisolated
1 transformer
(2 inductors)
isolated
1 transformer
(2 inductors)
isolated
Number of diodes323224
Component count1159698 + 2 (Cin and Cr)
Table 3. Key performance comparison of the state-of-the-art isolated proposed circuit.
Table 3. Key performance comparison of the state-of-the-art isolated proposed circuit.
ParameterRef [27]Ref [35]Ref [36]Ref [38]Ref [42]Ref [44]Proposed
Circuit
Range input voltage50 VDC30–70 VDC48 VDC38–50 VDC23–38 VDC30–50 VDC12 VDC
Range output voltage400 VDC350 VDC400 VDC380 VDC350 VDC350 VDC340 VDC
Switching frequency50 kHz70 kHz74 kHz200 kHz255 kHz100 kHz200 kHz
Range output power250 W1.5 kW400 W500 W150 W510 W250 W
Range efficiency≥90%≥90%≥90%≥85%≥90%≥90%≥90%
Conversion ratio8/111.6/5/18.3/110/8.6/7.6/115.2/9.2/111.6/7/128.3/1
Operation mode main stateZVSZVSZVSZCSZCSZVSZCS
Topology rectifiervolt double
2 modules
volt double
1 module
center tap II
1 module
bridge
1 module
volt double
1 module
volt double
1 module
bridge
1 module
Stress voltage/mode2 Vo/ZCS2 Vo/ZCS2 Vo/ZCSVo/ZCS2 Vo/ZCS2 Vo/ZCSVo/ZCS
Balance flux transformerN/Aunbalanceunbalancebalanceunbalanceunbalance
asymmetrical
balance
Useful parasitic
capacitance
neglectneglectneglectadoptionneglectneglectutilization
Classify resonantLC series
resonant
LC series resonantLC series
resonant
LC parallel
resonant
LC parallel
resonant
LC parallel
resonant
LC series
multiresonant
Number of inductors or transformer/capacitors2 transformers
3 capacitors
1 transformer
1 inductor
3 capacitors
1 transformer
1 inductor
1 capacitor
1 transformer
1 inductor
1 transformer
2 inductors
1 capacitor
1 transformer
1 inductor
1 capacitor
1 transformer
1 capacitor
Number of main switches2 switches2 switches
2 actives
2 switches2 switches2 switches2 switches
1 active
2 switches
Number of rectifiers side4 diodes
3 capacitors
2 diodes
3 capacitors
2 diodes
3 capacitors
4 diodes
2 capacitors
2 diodes
3 capacitors
2 diodes
3 capacitors
4 diodes
2 capacitors
Component count14131010111110
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Bilsalam, A.; Ekkaravarodome, C.; Chunkag, V.; Thounthong, P. Analyzing the Effect of Parasitic Capacitance in a Full-Bridge Class-D Current Source Rectifier on a High Step-Up Push–Pull Multiresonant Converter. Sustainability 2021, 13, 5477. https://0-doi-org.brum.beds.ac.uk/10.3390/su13105477

AMA Style

Bilsalam A, Ekkaravarodome C, Chunkag V, Thounthong P. Analyzing the Effect of Parasitic Capacitance in a Full-Bridge Class-D Current Source Rectifier on a High Step-Up Push–Pull Multiresonant Converter. Sustainability. 2021; 13(10):5477. https://0-doi-org.brum.beds.ac.uk/10.3390/su13105477

Chicago/Turabian Style

Bilsalam, Anusak, Chainarin Ekkaravarodome, Viboon Chunkag, and Phatiphat Thounthong. 2021. "Analyzing the Effect of Parasitic Capacitance in a Full-Bridge Class-D Current Source Rectifier on a High Step-Up Push–Pull Multiresonant Converter" Sustainability 13, no. 10: 5477. https://0-doi-org.brum.beds.ac.uk/10.3390/su13105477

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